Bump connections and wire bonds of 3D CMOL FPGA can serve as

Download scientific diagram | Bump connections and wire bonds of 3D CMOL FPGA can serve as programming communication channels and IOs respectively. from publication: 3D integration of CMOL structures for FPGA applications | In this paper, a novel 3D CMOS nanohybrid technology, 3D CMOL, is introduced to establish FPGA chips. By combining two leading technologies, hybrid CMOS/nanoelectronic circuit (CMOL) and 3D integration, 3D CMOL can provide a feasible and more efficient fabrication/assembly | FPGA, CMOS and FPGAs | ResearchGate, the professional network for scientists.

Fabrication and integration process of 3D CMOL.

Zine-Eddine ABID, Adjunct Professor, The University of Western Ontario, London, UWO, Department of Electrical and Computer Engineering

Zine-Eddine ABID, Adjunct Professor, The University of Western Ontario, London, UWO, Department of Electrical and Computer Engineering

US9171794B2 - Embedding thin chips in polymer - Google Patents

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Zine-Eddine ABID, Adjunct Professor, The University of Western Ontario, London, UWO, Department of Electrical and Computer Engineering

3D Integration of CMOL Structures for FPGA Applications

Abbildung 3.2: Wertemenge und Bildmenge von (m + jn) 4 für 5-Bit-ADCs

Abbildung A.1: Phasenverlauf von z