UBM (Under Bump Metallization)

Interconnection in IC Assembly - ppt video online download

Figure 6 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

15544557.ppt

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Flip Chip制程详解- 知乎

The bond pad redistribution layer (polyimide 1) and the under bump

1.3.2 Solder Bumps

Figure 8 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

MKChem & Tech

Interconnection in IC Assembly - ppt video online download