The outline of bump bond process steps. (1) deposition of field metal
Hans ANDERSSON, Principal Research Engineer
PDF) GaAs array fabrication
A. Peacock's research works European Space Agency, Paris (ESA) and other places
PDF) GaAs array fabrication
Top: X-ray image of a standard sardine, shown in the lower image, taken
Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding
Left) X-ray image of a line pair rule taken using an un-collimated
Hans ANDERSSON, Principal Research Engineer
The outline of bump bond process steps. (1) deposition of field metal
Left) X-ray image of a line pair rule taken using an un-collimated
The outline of bump bond process steps. (1) deposition of field metal
PDF) GaAs array fabrication
Hans ANDERSSON, Principal Research Engineer