The outline of bump bond process steps. (1) deposition of field metal

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Hans ANDERSSON, Principal Research Engineer

PDF) GaAs array fabrication

A. Peacock's research works European Space Agency, Paris (ESA) and other places

PDF) GaAs array fabrication

Top: X-ray image of a standard sardine, shown in the lower image, taken

Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding

Left) X-ray image of a line pair rule taken using an un-collimated

Hans ANDERSSON, Principal Research Engineer

The outline of bump bond process steps. (1) deposition of field metal

Left) X-ray image of a line pair rule taken using an un-collimated

The outline of bump bond process steps. (1) deposition of field metal

PDF) GaAs array fabrication

Hans ANDERSSON, Principal Research Engineer