Encapsulated and Molded

$ 23.50

4.5
(200)
In stock
Description

Molded Underfill(MUF) Semiconductor encapsulation Molding compounds

Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials X851C/D series for Fan Out Wafer Level Packaging (FOWLP) and Panel Level Packaging (PLP), Business Solutions, Products & Solutions

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Encapsulated and Molded

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