3-Pad LED Flip Chip COB by Flip Chip Opto — LED professional - LED Lighting Technology, Application Magazine
Wafer level packaging and flip chip design are the most recent trends in LED manufacturing and packaging. These LED types are perfectly suited for producing COB modules. This combination already promises better thermal performance than standard SMD package based products. However, there is still room for improvements. Pao Chen, Director of Research and Development at Flip Chip Opto shows how a 3-pad flip chip LED further reduces thermal resistance, allows higher power and can help to reduce costs.
New Class of Siloxane Polymers for Advanced LED Packaging — LED professional - LED Lighting Technology, Application Magazine
Tunable White COB LED Strip Light This LED light strip offers adjustable white light with a color temperature range from warm white to cool white
White CCT Tunable COB LED Strip Light
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3-Pad LED Flip Chip COB by Flip Chip Opto — LED professional - LED Lighting Technology, Application Magazine
Samsung introduces flip-chip mid-and high-power LEDs and COB module
Violumas Announces New Line of UV LED
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Flip Chip Opto Introduces 300 W, 600 W and 960 W CoB LEDs — LED professional - LED Lighting Technology, Application Magazine
Flip Chip - Yujileds
LEDs deliver more control and intelligence, as SSL aesthetics and
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